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rohs recast compliant industrial micro sd 3.0 specifications march 5 th , 2013 version 1.1 apacer technology inc. 4 th fl., 75 hsin tai wu rd., sec.1, xizhi, new taipei city, taiwan 221 tel: +886-2-2698-2888 fax: +886-2-2689-2889 www.apacer.com
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 1 ? 2013 apacer technology, inc. rev. 1.1 features: fully compatible with sd card association specifications - part 1, physical layer specification, version 3.1 final - part 3, security specification, version 3.0 final capacity range - 4, 8, 16, 32 gb performance* - sustained read: up to 19 mb/sec - sustained write: up to 12 mb/sec sd-protocol compatible supports sd spi mode backward compatible with 2.0 nand flash type: mlc operating frequency: up to 100 mhz intelligent endurance design - built-in advanced ecc algorithm - wear-leveling - flash bad-block management - built in write protect temperature ranges - operating temperature: -25 ~ +85c - storage temperature: -40c ~ +85c operating voltage: 2.7v ~ 3.6v power consumption* - operating: 47 ma - standby: 150 ua physical dimension : 15mm(l) x 11mm(w) x 1mm(h) rohs recast compliant (2011/65/eu) *vary from capacities. performance values presented here are typical and may vary depending on setting s and platforms.
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 2 ? 2013 apacer technology, inc. rev. 1.1 table of contents 1. general description ................................................... ................................................... . 3 1.1 p roduct f unction b lock ................................................... ................................................... ............ 3 1.2 f unctional description ................................................... ................................................... ............... 3 1.2.1 flash management ............................. ................................................... ....................................... 4 1.2.2 powerful ecc algorithms ...................... ................................................... .................................... 4 1.2.3 power management............................. ................................................... ...................................... 4 2. electrical characteristics ................................................... .......................................... 5 2.1 c ard a rchitecture ................................................... ................................................... ...................... 5 2.2 p in a ssignment ................................................... ................................................... ............................. 5 2.3 c apacity s pecification ................................................... ................................................... ................ 6 2.4 p erformance ................................................... ................................................... ................................ 6 2.5 e lectrical ................................................... ................................................... .................................... 6 3. physical characteristics ................................................... ............................................ 7 3.1 p hysical d imension ................................................... ................................................... ...................... 7 3.2 e nvironmental s pecifications ................................................... ................................................... .... 9 4. ac characteristics ................................................... ................................................... ..11 4.1m icro sd i nterface t iming (d efault ) ................................................... .......................................... 11 4.2 m icro sd i nterface t iming (h igh s peed m ode ) ................................................... ........................... 12 4.3 sd i nterface t iming (sdr12, sdr25 and sdr50 m odes ) i nput ................................................... 13 4.3.1 sdr50 input timing ........................... ................................................... ..................................... 13 4.3.2 output ....................................... ................................................... ............................................... 14 4.3.3 sd interface timing (ddr50 mode)............. ................................................... ........................... 14 4.3.4 bus timings ? parameters values (ddr50 mode) . ................................................... ................ 15 5. product ordering information ................................................... ................................16 5.1 p roduct c ode d esignations ................................................... ................................................... ..... 16 5.2 v alid c ombinations ................................................... ................................................... ................... 17
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 3 ? 2013 apacer technology, inc. rev. 1.1 1. general description as the demand of reliable and high-performance data storage in a small form factor increases, apacer?s micro sd card 3.0 is designed specifically for mult iple applications by offering high endurance, relia bility, and agility, where extreme flexibility, endurance, data integrity, and exceptionally transmission are required. the micro sd 3.0 card fully complies with sd card a ssociation standard. the command list is compatible with [part 1 physical layer specificatio n ver3.1 final] definitions, while the card capacit y of non-secure area, secure area supports [part 3 secur ity specification ver3.0 final] specifications. the card allows selection of either sd or spi mode for compatibility in data communication. to provide hig her transfer rate, the card can extend to 100mhz clock frequency. the card also comes with endurance features for dat a error detection and correction, write protection, and password protection. 1.1 product function block the micro sd contains a card controller and a memor y core for the sd standard interface. 1.2 functional description the micro sd device contains a high level, intellig ent flash management that provides many capabilitie s including: high performance flash memory control ecc algorithms wear leveling power management
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 4 ? 2013 apacer technology, inc. rev. 1.1 1.2.1 flash management the sd controller contains logic/physical flash blo ck mapping and bad block management system. it will manage all flash block including user data space an d spare block. the micro sd also contains a sophisticated defect a nd error management system. it does a read after write under margin conditions to verify that the da ta is written correctly (except in the case of writ e pre- erased sectors). in case that a bit is found to be defective, the sd will replace this bad bit with a spare bit within the sector header. if necessary, the micro s d will even replace the entire sector with a spare sector. this is completely transparent to the master (host device) and does not consume any user data space. 1.2.2 powerful ecc algorithms the powerful ecc algorithms will enhance flash bloc k use rate and whole device life. the sd controller supports up to 68bits ecc circuits to protect data transfer. 1.2.3 power management a power saving feature of the micro sd is automatic entrance and exit from sleep mode. upon completion of an operation, the sd will enter the sleep mode t o conserve power if no further commands are receive d within x seconds, where x is programmable by softwa re. the master does not have to take any action for this to occur. the sd is in sleep mode except when the host is accessing it, thus conserving power. any command issued by the master to the micro sd wi ll cause it to exit sleep mode and response to the master.
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 5 ? 2013 apacer technology, inc. rev. 1.1 2. electrical characteristics 2.1 card architecture 2.2 pin assignment sd mode spi mode pin name description name description 1 dat2 data line[bit 2] reserved 2 cd/dat3 2 card detect/data line [bit 3] cs chip select 3 cmd command/response di data in 4 vdd supply voltage vdd supply voltage 5 clk clock sclk clock 6 vss supply voltage ground vss supply voltage grou nd 7 dat0 data line[bit 0] do data out 8 dat1 data line[bit 1] reserved
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 6 ? 2013 apacer technology, inc. rev. 1.1 2.3 capacity specification the following table shows the specific capacity for the sd 3.0 card. capacity total bytes 4 gb 3,972,005,888 8 gb 7,960,788,992 16 gb 15,997,075,456 32 gb 32,078,036,992 note: total bytes are viewed under windows operatin g system and were measured by sd format too. 2.4 performance performances of the sd 3.0 card are shown in the ta ble below. capacity modes 4 gb 8 gb 16 gb 32 gb read (mb/s) 19 19 19 19 write (mb/s) 12 12 12 12 note: results may vary depending on settings and pl atforms. 2.5 electrical operating voltages symbol parameter min. max. unit v dd power supply voltage 2.7 3.6 v power consumption capacity modes 4 gb 8 gb 16 gb 32 gb operating ( ma ) 40 42 45 47 standby ( ua ) 100 100 100 150 note: results may vary depending on settings and pl atforms.
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 7 ? 2013 apacer technology, inc. rev. 1.1 3. physical characteristics 3.1 physical dimension
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 8 ? 2013 apacer technology, inc. rev. 1.1
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 9 ? 2013 apacer technology, inc. rev. 1.1 3.2 environmental specifications climatic testing test condition (gold series) test item dut state temperature duration storage 85 500 hours high temperature operation 85 168 hours storage - 40 300 hours low temperature operation - 25 168 hours storage 40 95% 500 hours high temperature & high humidity operation 40 95% 4 hour thermal cycling storage* - 40 ~ 85 30min hold each 20 cycles durability testing test item descriptions insertion/removal 10,000 cycles
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 10 ? 2013 apacer technology, inc. rev. 1.1 bending 10nt/stimes for 6 faces and 4 corners (each drop was performed 3 times, total of 30 drops) electrostatic discharge contact discharge: hcp & vcp air discharge: all C vss (), all C vcc () vcc C vss (), all C all () ultraviolet radiation units are non-operating. uvb bandwidth 313nm. test irradiation 0.63 w/m2/nm. radiation cycle radiation on for 4 hours at temperature 60c, then radiation off for 4 hours at temperature 50c. number of cycle 6 cycles. duration of test 48 hours drop 1.sm free fall, 10times salt water spray 3+/-1%nacl; 35 ; 24hrs torque 0.sn-m or 0.2sdegree s time; 30sec/direction
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 11 ? 2013 apacer technology, inc. rev. 1.1 4. ac characteristics 4.1 micro sd interface timing (default) symbol parameter min max unit note clock clk (all values are referred to min(v ih ) and max(v il ) f pp clock frequency data transfer mode 0 25 mhz c card ? 10 pf (1 card) f od clock frequency identification mode 0 (1) /100 400 khz c card ? 10 pf (1 card) t wl clock low time 10 - ns c card ? 10 pf (1 card) t wh clock high time 10 - ns c card ? 10 pf (1 card) t tlh clock rise time - 10 ns c card ? 10 pf (1 card) t thl clock fall time - 10 ns c card ? 10 pf (1 card) t isu input setup time 5 - ns c card ? 10 pf (1 card) t ih input hold time 5 - ns c card ? 10 pf (1 card)
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 12 ? 2013 apacer technology, inc. rev. 1.1 t odly output delay time 0 14 ns c l 40 pf (1 card) t odly output delay time during identification mode 0 50 ns c l 40 pf (1 card) (1)0hz means to stop the clock. the given minimum f requency range is for cases that requires the clock to be continued. 4.2 micro sd interface timing (high speed mode) symbol parameter min max unit note f pp clock frequency data transfer mode 0 50 mhz ccard ? 10 pf (1 card) t wl clock low time 7 - ns ccard ? 10 pf (1 card) t wh clock high time 7 - ns ccard ? 10 pf (1 card) t tlh clock rise time - 3 ns ccard ? 10 pf (1 card) t thl clock fall time - 3 ns ccard ? 10 pf (1 card) t isu input setup time 6 - ns ccard ? 10 pf (1 card) t ih input hold time 2 - ns ccard ? 10 pf (1 card) t odly output delay time 14 ns cl 40 pf (1 card) t oh output hold time 2.5 50 ns cl 15 pf (1 card) c l system capacitance of each line* 40 pf cl 15 pf (1 card) *in order to satisfy severe timing, host shall run on only one card
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 13 ? 2013 apacer technology, inc. rev. 1.1 4.3 sd interface timing (sdr12, sdr25 and sdr50 mod es ) input symbol min max unit remark t clk 4.80 - ns 208mhz (max.), between rising edge, vct= 0.975v t cr , t cf - 0.2* t clk ns t cr , t cf < 2.00ns (max.) at 100mhz, ccard=10pf clock duty 30 70 % 4.3.1 sdr50 input timing
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 14 ? 2013 apacer technology, inc. rev. 1.1 symbol min max unit sdr50 mode t is 3.00 - ns ccard =10pf, vct= 0.975v t ih 0.80 - ns ccard =5pf, vct= 0.975v 4.3.2 output symbol min max unit remark t odly - 7.5 ns t clk >=10.0ns, cl=30pf, using driver type b, for sdr50 t odly - 14 ns t clk >=20.0ns, cl=40pf, using driver type b, for sdr25 and sdr12, t oh 1.5 - ns hold time at the t odly (min.), cl=15pf 4.3.3 sd interface timing (ddr50 mode) symbol min max unit remark t clk 20 - ns 50mhz (max.), between rising edge t cr , t cf - 0.2* t clk ns t cr , t cf < 4.00ns (max.) at 50mhz, ccard=10pf clock duty 45 55 %
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 15 ? 2013 apacer technology, inc. rev. 1.1 4.3.4 bus timings ? parameters values (ddr50 mode) symbol parameters min max unit remark input cmd (referenced to clk rising edge) t isu input set-up time 6 - ns c card ? 10 pf (1 card) t ih input hold time 0.8 - ns c card ? 10 pf (1 card) output cmd (referenced to clk rising edge) t odly output delay time during data transfer mode - 13.7 ns c l 30 pf (1 card) t oh output hold time 1.5 - ns c l 15 pf (1 card) inputs dat (referenced to clk rising and falling edges) t isu2x input set-up time 3 - ns c card ? 10 pf (1 card) t ih2x input hold time 0.8 - ns c card ? 10 pf (1 card) outputs dat (referenced to clk rising and falling edges) t odly2x output delay time during data transfer mode - 7.0 ns c l 25 pf (1 card) t oh2x output hold time 1.5 - ns c l 15 pf (1 card)
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 16 ? 2013 apacer technology, inc. rev. 1.1 5. product ordering information 5.1 product code designations a p ? msd x x x c x 4 x ? 1 tm configuration s one chip d two chip h four chip model name apacer product code capacities: 04g: 4gb 08g 8gb 16g 16gb 32g 32gb temperature: c: commercial temperature i: extended temperature f/w flash type: t: toshiba mlc ctl solution 4: sdhc
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 17 ? 2013 apacer technology, inc. rev. 1.1 5.2 valid combinations 5.2.1 commercial temperature capacity ap/n 4gb ap-msd04gcs4p-1tm 8gb ap-msd08gcs4p-1tm 16gb ap-msd16gcd4p-1tm 32gb AP-MSD32GCH4P-1TM note: please consult with apacer sales representatives fo r availabilities.
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 18 ? 2013 apacer technology, inc. rev. 1.1 revision history revision description date 1.0 official release 03/01/2013 1.1 revised operating temperature 03/05/2013
industrial micro sd 3.0 ap-msdxxxcx4p-1tm 19 ? 2013 apacer technology, inc. rev. 1.1 global presence taiwan (headquarters) apacer technology inc. 4 th fl., 75 hsin tai wu rd., sec.1 hsichih, new taipei city taiwan 221 r.o.c. tel: +886-2-2698-2888 fax: +886-2-2698-2889 amtsales@apacer.com u.s.a. apacer memory america, inc. 386 fairview way, suite102, milpitas, ca 95035 tel: 1-408-518-8699 fax: 1-408-935-9611 sa@apacerus.com japan apacer technology corp. 5f, matsura bldg., shiba, minato-ku tokyo, 105-0014, japan tel: 81-3-5419-2668 fax: 81-3-5419-0018 jpservices@apacer.com europe apacer technology b.v. science park eindhoven 5051 5692 eb son, the netherlands tel: 31-40-267-0000 fax: 31-40-267-0000#6199 sales@apacer.nl china apacer electronic (shanghai) co., ltd 1301, no.251,xiaomuqiao road, shanghai, 200032, china tel: 86-21-5529-0222 fax: 86-21-5206-6939 sales@apacer.com.cn india apacer technologies pvt ltd, # 535, 1st floor, 8th cross, jp nagar 3rd phase, bangalore ? 560078, india tel: 91-80-4152-9061 sales_india@apacer.com
mouser electronics authorized distributor click to view pricing, inventory, delivery & lifecycle information: apacer: ? ap-msd04gcs4p-1tm? ap-msd08gcs4p-1tm? ap-msd16gcd4p-1tm

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